Heat Shrink Solderable Butts-IP68 Waterproof, Double Solder Sleeves
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Heat Shrink Solderable Butts-IP68 Waterproof, Double Solder Sleeves

SPECIFICATION
MATERIAL: HEAT-SHRINKABLE POLYOLEFIN TUBE; LEAD-FREE TIN SOLDER SLEEVE; MELTABLE THERMALLY STABILIZED THERMOPLASTIC ADHESIVE RING.
WORKING TEMP.: -55℃ ~ 125℃
MIN. SHRINK TEMP.: 80℃
MIN. MELTING TEMP.: 138℃
FULLY MELTING TEMP.: 160℃
DIELECTRIC STRENGTH: 1kV
STANDARD: IP68 & RoHS
  • TM-HS-SB-D

  • ES

  • 85369090

Availability:
Quantity:

HEAT SHRINK SOLDERABLE BUTTS - IP68 WATERPROOF, DOUBLE SOLDER SLEEVES


SPECIFICATION

MATERIAL

HEAT-SHRINKABLE POLYOLEFIN TUBE; LEAD-FREE TIN SOLDER SLEEVE; MELTABLE THERMALLY STABILIZED THERMOPLASTIC ADHESIVE RING.

WORKING TEMP.

-55℃ ~ 125℃

MIN. SHRINK TEMP.

80℃

MIN. MELTING TEMP.

138℃

FULLY MELTING TEMP.

160

DIELECTRIC STRENGTH

1kV

STANDARD

IP68 & RoHS

DESCRIPTION

SHRINK RATIO 2:1

MELTABLE THERMALLY STABILIZED THERMOPLASTIC PROVIDES EXCELLENT WATERPROOF PROPERTY.

HIGH ELASTICITY KEEPS STEADY PERFORMANCE.

TRANSPARENT SLEEVE PROVIDES PRECISE INSPECTION.

USER-FRIENDLY SOLDERING PROCESS.

EASE CODE

SOLDER SLEEVE (mm)

AS SUPPLIED (mm)

AFTER RECOVERY (mm)

LENGTH (mm)

WIRE RANGE

I.D

(C3)

Thickness

(T2)

A2/A3

I.D

(C1)

I.D

(C2)

Thickness

(T1)

I.D.

Thickness

L

mm²
(A.W.G)

TM-HS-SB-0.5D

1.9

0.6

0.6

2.1

1.8

0.4

1.0

0.5

26.5

0.25-0.5
(26-24)

TM-HS-SB-1.5D

2.9

0.7

1.5

3.4

2.7

0.5

1.5

0.6

40.5

0.5-1.5
(22-16)

TM-HS-SB-2.5D

4.9

0.8

1.5

5.1

4.5

0.4

2.2

0.7

40.5

1.5-2.5
(16-14)

TM-HS-SB-6.0D

7.4

1.0

1.5

8.0

7.0

0.4

3.5

0.7

40.5

4.0-6.0
(12-10)


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